February 16, 2012
Rudy Kellner, VP & GM Electronics Business Unit, FEI
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Rudy Kellner, VP & GM
Electronics Business Unit,
FEI
|
3D packaging
integration continues to increase in complexity, and as a result, it is driving
more samples into FA labs for development support and failure analysis.
Focused
ion beam (FIB) systems have traditionally been used for this type of
site-specific sectioning and analysis in the front end of processing, but
conventional FIB cannot remove material fast enough to analyze the relatively
large structures used in 3D integration.
In addition, due to the increase in
sample numbers, there is also a need for larger removal volumes for many of the
jobs, compounding the increased need for tool time and resources to meet the
demand.
FEI has recently developed a new technology, the Vion PFIB system, which
uses a plasma source to provide material removal rates 20X faster than
conventional FIBs while still preserving excellent milling precision and
imaging resolution at low beam currents.
We see this capability becoming essential for
failure analysis of advanced 3D-integrated systems, as well as enabling new
techniques in package edit and package repair applications.
Rudy Kellner, VP & GM Electronics Business Unit
FEI
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