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February 16, 2012

Rudy Kellner, VP & GM Electronics Business Unit, FEI

Rudy Kellner, VP & GM Electronics Business Unit, FEI
Rudy Kellner, VP & GM
Electronics Business Unit,
FEI
3D packaging integration continues to increase in complexity, and as a result, it is driving more samples into FA labs for development support and failure analysis.

Focused ion beam (FIB) systems have traditionally been used for this type of site-specific sectioning and analysis in the front end of processing, but conventional FIB cannot remove material fast enough to analyze the relatively large structures used in 3D integration.

In addition, due to the increase in sample numbers, there is also a need for larger removal volumes for many of the jobs, compounding the increased need for tool time and resources to meet the demand.

FEI has recently developed a new technology, the Vion PFIB system, which uses a plasma source to provide material removal rates 20X faster than conventional FIBs while still preserving excellent milling precision and imaging resolution at low beam currents.

We see this capability becoming essential for failure analysis of advanced 3D-integrated systems, as well as enabling new techniques in package edit and package repair applications.

Rudy Kellner, VP & GM Electronics Business Unit
FEI