Lori S. Nye, COO/Executive Director, Customer Operations, Brewer Science

Lori S. Nye, COO/Executive Director, Customer Operations, Brewer Science

The ZoneBond(TM) process, with its survivability through 3D processing steps and its low-stress, room temperature debonding, is a key reason for this change. This technology allows people to see the potential of 3D while lowering their risk. As a result, the industry will be adopting 3D at a faster pace in 2012.

Continued work in R&D to create new processes and materials for each customer’s individual needs is a key initiative for Brewer Science. This capability is truly one of Brewer Science's strengths -- we can understand all aspects of the customer's process and how the materials and equipment interact in these processes. We create customized long-term solutions for their unique requirements.

Brewer Science will continue to invent, improve, and enhance package processing not just in thin wafer bonding but also across all packaging processes.

We will be introducing new products. The top items that we will be introducing for thin wafer bonding are more thermally stable materials for higher process temperatures, new processes to assist with TTV challenges, and new semi-automated tooling. We will also have new processes and materials that will address other packaging process needs. Watch for upcoming announcements in all of these areas.

TSV and 3D packaging will be a critical part of more and more new devices in 2012. As to 450‑mm wafer manufacturing, when the industry is ready, we will support it.