January 31, 2012
Bruce W. Hueners, President and CEO, Palomar Technologies, Inc.
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Bruce W. Hueners,
President and CEO,
Palomar Technologies, Inc.
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Looking forward to
2012, the strong foundation from Palomar Technologies’ 2011 performance allows
us to stay focused on our customers' increased demand for improved
functionality and performance in advanced application and process development.
Palomar Technologies has
remained on the leading edge of packaging trends, ensuring enhanced device
performance with increasing miniaturization. Developments in TSVs and WLP will
demand the most advanced micro/optoelectronic packaging equipment, tools and
expertise coupled with unique contract assembly capabilities. These factors will
play a critical role in the coming years on how far 3D packaging can go to
achieve the optimum performance and functionality.
Palomar Technologies is
unique as an OEM for high-accuracy wire bond and die attach equipment
integrated with precision assembly services in secure clean room laboratories.
Customers gain the ability to prototype and develop critical processes and
materials with an OEM, utilizing highly skilled engineers and the most advanced
process tools, reducing risk and shortening time-to-market for today’s leading-edge
applications.
Bruce W. Hueners, President and CEO
Palomar Technologies, Inc.
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