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January 31, 2012

Bruce W. Hueners, President and CEO, Palomar Technologies, Inc.

Bruce W. Hueners, President and CEO, Palomar Technologies, Inc.
Bruce W. Hueners,
President and CEO,
Palomar Technologies, Inc.
Looking forward to 2012, the strong foundation from Palomar Technologies’ 2011 performance allows us to stay focused on our customers' increased demand for improved functionality and performance in advanced application and process development.

Palomar Technologies has remained on the leading edge of packaging trends, ensuring enhanced device performance with increasing miniaturization. Developments in TSVs and WLP will demand the most advanced micro/optoelectronic packaging equipment, tools and expertise coupled with unique contract assembly capabilities. These factors will play a critical role in the coming years on how far 3D packaging can go to achieve the optimum performance and functionality.

Palomar Technologies is unique as an OEM for high-accuracy wire bond and die attach equipment integrated with precision assembly services in secure clean room laboratories. Customers gain the ability to prototype and develop critical processes and materials with an OEM, utilizing highly skilled engineers and the most advanced process tools, reducing risk and shortening time-to-market for today’s leading-edge applications.

Bruce W. Hueners, President and CEO
Palomar Technologies, Inc.