February 7, 2012
Daniel L. Donabedian, President and CEO, Ziptronix Inc.
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Daniel L. Donabedian, President and CEO, Ziptronix Inc.
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Although specific market forecasts differ -- some positive and some
negative -- there seems to be overall agreement that 2012 will get off to a relatively
slow start for the semiconductor industry. However, ultra thin high-performance
laptops are a potential positive variable in the equation.
This new breed is
far different from its distant cousin the underpowered netbook. Ultrathins utilize
3D technology, which has enabled the transition to new form factors and will
power the transition into the next semiconductor cycle.
Ziptronix 3D
process technologies can be technically enabling or reduce overall costs for
our customers, depending on the end application. These technologies have been
demonstrated in a number of applications from image sensors to PICO projection and
the memory space.
Ziptronix bonding technology has been licensed within the
CMOS image sensor space to allow customers to manufacture image sensors with
improved performance, smaller die sizes and reduction in costs. As the 3D
market ramps strongly this year, we plan to grow our revenue by expanding into
new applications.
Ziptronix believes the key to success in 2012 is 3D bonding technology.
That technology must offer a competitive advantage to customers so that they,
in turn, can increase their market share and save costs.
Daniel L. Donabedian, President and CEO
Ziptronix Inc.
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