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February 7, 2012

Daniel L. Donabedian, President and CEO, Ziptronix Inc.

Daniel L. Donabedian, President and CEO, Ziptronix Inc.
Daniel L. Donabedian,
President and CEO,
Ziptronix Inc.
Although specific market forecasts differ -- some positive and some negative -- there seems to be overall agreement that 2012 will get off to a relatively slow start for the semiconductor industry. However, ultra thin high-performance laptops are a potential positive variable in the equation.

This new breed is far different from its distant cousin the underpowered netbook. Ultrathins utilize 3D technology, which has enabled the transition to new form factors and will power the transition into the next semiconductor cycle.

Ziptronix 3D process technologies can be technically enabling or reduce overall costs for our customers, depending on the end application. These technologies have been demonstrated in a number of applications from image sensors to PICO projection and the memory space.

Ziptronix bonding technology has been licensed within the CMOS image sensor space to allow customers to manufacture image sensors with improved performance, smaller die sizes and reduction in costs. As the 3D market ramps strongly this year, we plan to grow our revenue by expanding into new applications.

Ziptronix believes the key to success in 2012 is 3D bonding technology. That technology must offer a competitive advantage to customers so that they, in turn, can increase their market share and save costs.

Daniel L. Donabedian, President and CEO
Ziptronix Inc.