January 26, 2012
Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.
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Brian Schmaltz,
Western Area
Sales Manager,
NAMICS
Technologies
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I would expect to see 2012 continue to provide slow growth, as
an industry I would predict 2012 to be a year of change. Continued trend to
smaller, lighter, longer life portable electronics such as smart phones and
tablets with communication to a network system at faster speeds (Cloud, 4G+).
Packaging and manufacturing engineers pushing the boundaries with sub 28nm
node, low-k, 450mm, and 2.5D & 3D packaging will require new assembly line
materials, equipment development, and implementation.
NAMICS is working in
conjunction with customers towards advanced product packaging solutions for
solutions to; High Thermal Conductivity, Low Warpage, Void Free, High
Reliability, High Yield, and Ease of Manufacturability Materials.
Brian Schmaltz, Western Area Sales Manager
NAMICS Technologies Inc.
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