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January 26, 2012

Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.

Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.
Brian Schmaltz,
Western Area
Sales Manager,
NAMICS
Technologies
I would expect to see 2012 continue to provide slow growth, as an industry I would predict 2012 to be a year of change. Continued trend to smaller, lighter, longer life portable electronics such as smart phones and tablets with communication to a network system at faster speeds (Cloud, 4G+).

Packaging and manufacturing engineers pushing the boundaries with sub 28nm node, low-k, 450mm, and 2.5D & 3D packaging will require new assembly line materials, equipment development, and implementation.

NAMICS is working in conjunction with customers towards advanced product packaging solutions for solutions to; High Thermal Conductivity, Low Warpage, Void Free, High Reliability, High Yield, and Ease of Manufacturability Materials.

Brian Schmaltz, Western Area Sales Manager
NAMICS Technologies Inc.