January 23, 2012
Neil O'Brien, Director of Sales, Finetech
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Neil O'Brien,
Director of Sales,
Finetech
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Despite
the overall economic challenges, Finetech had a very successful 2011. Our
SMT rework products continue to fill the demands for POP, 01005 and QFN
repair. Two years ago, we added Martin GmbH to the Finetech family. The Martin products have become well known in the areas of BGA reballling and
economical repair of game board, LED, and mobile devices.
In the microelectronics and die attach markets,
we still have reason for a positive outlook in 2012. With our unique
modular philosophy built around high accuracy base systems, we are the chosen
solution for so many areas of assembly. Our sub-micron platforms like the
Lambda and Femto are continually in demand for the most advanced applications
in Optoelectronics, Sensors, Biomedical, Nano and others. Our Matrix MA
bonder addresses high accuracy bonding while allowing large device and
substrate capability. 300mm wafer substrates are now possible.
With all companies
trying to do more with less, Finetech is well positioned to address those needs
across a broad spectrum of applications. While I cannot predict the
production volumes to come, I can say that the desire to innovate will be alive
and well in 2012.
Neil O'Brien, Director of Sales
Finetech
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