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  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
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New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK


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