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  Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
Asymtek
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
imageYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech
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Hesse & Knipps BONDJET BJ920
heavy wire bonder integrates pull and shear test
imageHesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more…
Hesse & Knipps


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